4 State of the art automated surface mount manufacturing lines

• Solder Paste Printing utilizing multi-dimensional inspection
• Component placement equipment utilizing placement accuracy to .025mm and speeds of 40,000 cph
• Auto board loaders and board flow conveyors allowing maximized efficiencies and hands free assembly
• High efficiency convection ovens with thermal uniformity provide for excellent re-flow soldering profiling and process control
• BGA and fine pitch placement proficiency
• Automated optical inspection with capabilities of part identification as small as 0201 components and speeds of over 200,000 components per hour
• High-resolution real time X-ray inspection

Automated Through-Hole Placement

• DIP, radial, and axial component placements
• Custom robotic placement equipment
• Program generation through Gerber manipulation
• High-resolution real time X-ray inspection

Test equipment

• Automated In-Circuit Testing available on multiple platforms
• Power supply functional testing
• Assembly burn-in capabilities with temperature options

Automated soldering equipment

• CPU controlled automated soldering allows repeatability of processes
  

Cleaning Requirements

• High performance aqueous cleaning processes
• Ionic testing to validate process controls and product standards

Value Add Processes

• Standard component prep
• Custom fixture and tooling design for non-standard components
• Box build
• Conformal coating
• Pinning
• Ultrasonic welding
• Panel routing
• Low volume programming capabilities