Capital Equipment

PCBA Level Assembly

Screen Print:
        DEK Europa
        Dek 265LT
Placement:
        Universal Genesis Lightning (HSC) chipshooter
        Universal Multi Function Placement Machine
        Fuji CP-643 and IP-3
Reflow Ovens:
        Rehm 10 x 3
        Electrovert OmniFlo 7's - 7 Zone
In-Line Adhesive Dispenser:
        CAMALOT XyflexPro
Selective Solder:
        Ersa Versaflow - Dual Track / Dual Head
Wave Solder:
        Electrovert Vectra - 2 Machines
Conveyor Automation:
        ConveyorTech - with Barcode Line Changeover
BGA Repair:
        VJ Electronix Summit 1800

PCBA Level Test

AOI:
        Photon Dynamics - 4 Machines
AXI:
        Agilent X-6000 Lamanography
In-Circuit Test:
        Agilent 3070
        Genrad 2287 (Teradyne)
        Teradyne 1860, 1882:
FCT Platforms:
        FineTest Power Supply
        Onyx Standard Tester
        Custom
Flying Probe:
        SPEA
First Article Vision System:
        Cluso First Article Inspection System
HASS Chamber:
        Rapid Therm
        Thermotron Temperature/Humidity

System Level / PCBA 2nd Level Assembly

De-panel:
        Maestro
Conformal Coating:
        Automated UV & Acrylic
        PVA and Nordson
Ultrasonic Welding:
        Branson
Top Level & Sub-Assembly Functional Test:
        HiPOT
        Ground Bond
        Patient Leakage
        Defib
        FineTest Power Supply
        Onyx Standard Tester
        Custom

If your organization is seeking a true full service outsourcing partner, you owe it to yourself to look at Today’s Onyx, contact us.